Servers / Lenovo
ThinkSystem ST550 - 1.7 GHz - 3106 - 16 GB - DDR4-SDRAM - 750 W - Tower
USB 2.0 ports quantity: 3, VGA (D-Sub) ports quantity: 1, USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity: 3, Performance management: XClarity Standard
Product code / SKU: 7X10A01FEA
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Explore the Lenovo 7X10A01FEA
ThinkSystem ST550 - 1.7 GHz - 3106 - 16 GB - DDR4-SDRAM - 750 W - Tower. USB 2.0 ports quantity: 3. VGA (D-Sub) ports quantity: 1. USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity: 3.
Details that matter
Performance management is specified as XClarity Standard. Trusted Platform Module (TPM) is specified as Yes. Trusted Platform Module (TPM) version is specified as 1.2.
Designed for your setup
USB 2.0 ports quantity: 3. VGA (D-Sub) ports quantity: 1. USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity: 3. Power supply input frequency: 50 - 60 Hz.
Connections at a glance
- USB 2.0 ports quantity3
- VGA (D-Sub) ports quantity1
- USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
- Power supply input frequency50 - 60 Hz
Position & installation
- Height425.5 mm
Check your intended configuration before ordering. Maximum operating modes depend on the connected equipment and settings. Images illustrate the product; screen content may be simulated.
Specifications
Product identity
- Brand
- Lenovo
- Model number
- 7X10A01FEA
- EAN
- 889488443154
- Processor model
- 3106
- On-board graphics card model
- Matrox G200
Connections & audio
- USB 2.0 ports quantity
- 3
- VGA (D-Sub) ports quantity
- 1
- USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity
- 3
Product specifications
- Performance management
- XClarity Standard
- Trusted Platform Module (TPM)
- Yes
- Trusted Platform Module (TPM) version
- 1.2
- Processor manufacturer
- Intel
- Processor socket
- LGA 3647 (Socket P)
- Processor family
- Intel® Xeon®
- Processor lithography
- 14 nm
- Processor threads
- 8
- Execute Disable Bit
- Yes
- Processor frequency
- 1.7 GHz
- Number of processors installed
- 1
- Maximum internal memory supported by processor
- 768 GB
- Memory clock speeds supported by processor
- 2133
- Processor operating modes
- 64-bit
- Processor cache
- 11 MB
- Processor generation
- 1st Generation Intel® Xeon® Scalable
- Maximum number of PCI Express lanes
- 48
- Processor cache type
- L3
- Tcase
- 77 °C
- Embedded options available
- Yes
- Scalability
- 2S
- Memory types supported by processor
- DDR4-SDRAM
- Stepping
- U0
- Conflict-Free processor
- Yes
- Processor codename
- Skylake
- Processor code
- SR3GL
- Memory channels supported by processor
- Hexa
- ECC supported by processor
- Yes
- Processor package size
- 76.0 x 56.5 mm
- Processor cores
- 8
- Internal memory type
- DDR4-SDRAM
- Memory slots
- 12
- Internal memory
- 16 GB
- Memory layout (slots x size)
- 1 x 16 GB
- Memory clock speed
- 2666 MHz
- Maximum internal memory
- 768 GB
- Ethernet LAN
- Yes
- Cabling technology
- 10/100/1000Base-T(X)
- RAID support
- Yes
- RAID levels
- 0, 1, 5, 6, 10, 50, 60
- Supported RAID controllers
- 530-8i
- Supported HDD sizes
- 2.5, 3.5
- HDD interface
- Serial Attached SCSI (SAS), serial_ata
- Hot-Plug support
- Yes
- Optical drive type
- DVD±RW
- Hot-swap
- Yes
- Intel® AES New Instructions (Intel® AES-NI)
- Yes
- Enhanced Intel SpeedStep Technology
- Yes
- Intel Trusted Execution Technology
- Yes
- Intel® Turbo Boost Technology
- No
- Intel TSX-NI version
- 1.00
- Intel® Hyper Threading Technology (Intel® HT Technology)
- No
- Intel VT-x with Extended Page Tables (EPT)
- Yes
- Intel TSX-NI
- Yes
- Intel 64
- Yes
- Intel Virtualization Technology for Directed I/O (VT-d)
- Yes
- Intel Virtualization Technology (VT-x)
- Yes
- Processor ARK ID
- 123540
- On-board graphics card
- Yes
- Chassis type
- Tower
- Storage relative humidity (H-H)
- 8 - 90
- Storage temperature (T-T)
- -10 - 60
- Operating altitude
- 0 - 3048
- Operating relative humidity (H-H)
- 20 - 80
- Operating temperature (T-T)
- 10 - 35
- PCI Express x8 (Gen 3.x) slots
- 2
- PCI Express x16 (Gen 3.x) slots
- 2
- PCI Express slots version
- 3.0
- Sustainability certificates
- ENERGY STAR
- Compatible operating systems
- Microsoft Windows Server 2016/2012 R2, Red Hat Enterprise Linux 7.3/6.9, SUSE, Linux Enterprise Server 12 SP2/11 SP4, VMware vSphere (ESXi) 6.5/6.0 U3
- Width
- 175.8 mm
- Depth
- 666.4 mm
Setup & dimensions
- Thermal Design Power (TDP)
- 85.0000
- Power supply
- 750.0000
- Power supply input frequency
- 50 - 60 Hz
- Redundant power supply (RPS) support
- Yes
- Number of main power supplies
- 1
- Height
- 425.5 mm
Ordering & delivery
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Before you order
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